main features
1. Applicable wafer specifications: 4 inches -6 inches -8 inches;
2. Dual arm transmission method;
3. The wafer fixing methods include vacuum adsorption, lower support, and edge clamping, with optional methods available;
4. The fork can be made of ceramic, carbon fiber, aluminum alloy, and other materials to choose from;
5. Control adopts positive motion control mode;
6. Modular design, compatible with various machine configurations;
7. Additional running axes can be added as needed;
8. Automatic Mapping function can be added to the fork;
9. Operation safety protection alarm;
10. Closed working environment;
11. Passed SEMI S2 certification;